Improving semiconductor manufacturing with piezoelectric force measurement

Force is a critical factor in numerous semiconductor manufacturing processes. Deviations can lead to damages in microchips, internal fractures and defective products. Learn how force can be measured, monitored and controlled with piezoelectric force sensors.

This webinar is relevant for the following semiconductor manufacturing processes:

  • Thermal compression bonding
  • Pick and place
  • Die bonding
  • Wafer manufacturing
  • Join our webinar and find out how this is possible.
详情:
主讲人:
  • Kevin Tan Su Min, Country Manager
  • Teddy Teo Hung Liang, Regional Service Engineer
  • Robert Hillinger, Head of Application Management
时长:
60 min
中文:
EN
录制日期:
19.05.2022
联系方式
文件大小不超过 25 MB