Kistler, the global market leader in dynamic pressure, force, torque and acceleration measurement technology, will share a stand with the NETZSCH Group at JEC World 2019 from 12 to 14 March in Paris. Visitors to stand R20 in hall 6 can see how technologies from the two companies complement each other ideally in plastic composites processing. Both product portfolios will be showcased, and a simulation will show how the combination of information from mold filling and characteristic material values represents a major step towards intelligent part production.
Composite materials are already well established in many sectors: thanks to their special characteristics based on combinations of different materials, they broaden the scope for design and development in application areas such as aerospace and vehicle manufacturing. But in return for these advantages, manufacturers are confronted with increasing complexity in processes such as RTM (Resin Transfer Molding) and electronics overmolding. The challenge now: how to overcome these complexities reliably?
ComoNeo by Kistler, the leading process monitoring system for intelligent plastics processing, includes the ComoNeoCOMPOSITES feature to allow process monitoring for cycles of up to eight hours – which can be required for complex parts with large surface areas. In addition to ComoNeoCOMPOSITES, ComoNeo also enables direct integration, visualization and analysis of external sensor signals.
Visitors to the stand shared by NETZSCH and Kistler can see a live demonstration of how an integrated system solution can significantly enhance process reliability in composites production. To achieve this, dielectric analysis (DEA) signals supplied by NETZSCH sensors are integrated directly in ComoNeo.
Mold filling and material cross-linking can now be monitored by a complete, coordinated system thanks to the combination of DEA sensor technology from NETZSCH and Kistler's cavity pressure sensor technology.