Bonding with No Compromises
Customized Industrial Solutions from Kistler
Comprehensive process control is essential to ensure that wire bonding produces clean contacts. Piezoelectric sensor technology enables indirect measurements of the contact so that qualitative statements can be made on the completed wire bond connection. Kistler offers customized measuring chains that can be ideally adapted to the process being measured.
Advantages of process monitoring for bonding with Kistler:
- Solutions to match specific functions
- High-volume production
- Optimized supply chain
- Original Equipment Manufacturer (OEM) products
Precise measurements for high-quality wire bond connections. Simply contact us!