Advanced Packaging Conference (APC) at Semicon Europa 2021 in Munich

Join us at the Advanced Packaging Conference (APC) during Semicon Europa 2021 in Munich on November 18 at the Expert Talk. Robert Hillinger, Business Development Manager Advanced Manufacturing at Kistler, will hold a presentation titled “Monitor Mechanical Stress and Damage in Advanced Packaging”, at 5:10 p.m. in the Executive Forum, Hall B2. 

Learn how dynamic force measurement methods can support semiconductor manufacturing and packaging companies to benefit from higher process visibility and performance, lower quality costs and 100 % traceability of process data. 

We look forward to meeting you at the Advanced Packaging Conference (APC) at Semicon Europa 2021 in Munich. Get your ticket here.

Advanced Packaging Conference (APC) at Semicon Europa 2021 in Munich
18.11.2021
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10:00 - 18:00
Executive Forum, Hall B2
Munich
Kristina Palffy
Kristina Palffy
Marketing Project Manager
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Max 25 MB