Improving semiconductor manufacturing with piezoelectric force measurement

Force is a critical factor in numerous semiconductor manufacturing processes. Deviations can lead to damages in microchips, internal fractures and defective products. Learn how force can be measured, monitored and controlled with piezoelectric force sensors.

This webinar is relevant for the following semiconductor manufacturing processes:

  • Thermal compression bonding
  • Pick and place
  • Die bonding
  • Wafer manufacturing
  • Join our webinar and find out how this is possible.

Can’t attend live? No worries. We will be recording the session anyway. Please register to receive the recording into your inbox after the webinar.

발표자:
  • Kevin Tan Su Min, Country Manager
  • Teddy Teo Hung Liang, Regional Service Engineer
  • Robert Hillinger, Head of Application Management
Improving semiconductor manufacturing with piezoelectric force measurement
2022. 5. 19.
15:00 CST (UTC+8)
60 min
EN
연락처
Max 25 MB