Dynamic Force Measurement: Quality Improvement in Semiconductor Production Processes

The advancements in semiconductor technology and added device complexity put additional pressure on monitoring and controlling semiconductor manufacturing processes. Currently chip test, monitoring and control of packaging processes is widely done via optical inspection, displacement sensors and electrical testing. Improved methods for process monitoring and failure identification are needed to maintain or improve the quality and yield of a packaging process.

The physical force quantity causing a device failure may not be accessible to conventional measuring methods but is equally important to control and monitor production processes.

Piezo dynamic force measurement technology allows force to be monitored and controlled with high resolution, even at low forces. As a result, deviations can be detected early, errors avoided, and semiconductor advanced packaging equipment builders can achieve higher and more accurate machine performance. Semiconductor manufacturing packing companies benefit from higher process visibility, performance, lower quality cost and traceability of process data.

講師:
  • Robert Hillinger, Business Development Manager, Kistler Group
  • Jim Macy, Application Expert, Kistler Group
Dynamic Force Measurement: Quality Improvement in Semiconductor Production Processes
2021/03/30
16:00 CEST (UTC+2)
60 min
EN
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