Dynamic Force Measurement: Quality Improvement in Semiconductor Production Processes

The advancements in semiconductor technology and added device complexity put additional pressure on monitoring and controlling semiconductor manufacturing processes. Improved methods for process monitoring and failure identification are needed to maintain or improve the quality and yield of a packaging process. Let our experts Robert Hillinger and Jim Macy explain you how Kistler can help you to improve the quality and performance of your semiconductor production.

Détails:
Intervenants:
  • Robert Hillinger, Business Development Manager, Kistler Group
  • Jim Macy, Application Expert, Kistler Group
Durée:
60 min
Language:
EN
Date d’enregistrement:
25/02/2021
Contact
Max 25 MB