Bonding with No Compromises

Customized Industrial Solutions from Kistler

Comprehensive process control is essential to ensure that wire bonding produces clean contacts. Piezoelectric sensor technology enables indirect measurements of the contact so that qualitative statements can be made on the completed wire bond connection. Kistler offers customized measuring chains that can be ideally adapted to the process being measured.

Advantages of process monitoring for bonding with Kistler:

  • Solutions to match specific functions
  • High-volume production
  • Optimized supply chain
  • Original Equipment Manufacturer (OEM) products

Precise measurements for high-quality wire bond connections. Simply contact us!

Contact
Jani Laatikainen
Sales Representative
Benefits

Quality control

Process reliability

Increased productivity

Optimized resources

Products are simple to integrate

Services

Precise measurements for the entire life of the sensor.

Our experts are happy to assist and advise.