Improving semiconductor manufacturing with piezoelectric force measurement

Force is a critical factor in numerous semiconductor manufacturing processes. Deviations can lead to damages in microchips, internal fractures and defective products. Learn how force can be measured, monitored and controlled with piezoelectric force sensors.

This webinar is relevant for the following semiconductor manufacturing processes:

  • Thermal compression bonding
  • Pick and place
  • Die bonding
  • Wafer manufacturing
  • Join our webinar and find out how this is possible.
Details:
Referenten:
  • Kevin Tan Su Min, Country Manager
  • Teddy Teo Hung Liang, Regional Service Engineer
  • Robert Hillinger, Head of Application Management
Dauer:
60 min
Sprache:
EN
Datum der Aufzeichnung:
19.05.2022
Kontakt
Max 25 MB