民生用電子機器（3C）市場は競争が激化しています。メーカー各社は、製品の品質、安全性、耐久性、信頼性、および性能を最高水準に保つことに注力しています。これらはすべて、ライフサイクルコストや品質コストの管理、顧客の信頼の構築、そしてブランドの評判維持にとって極めて重要です。輸送、保管、または使用中に、機械的、熱的、あるいは環境的な要因が製品に影響を及ぼす可能性があります。
リコールや保証請求は莫大なコストを伴います。したがって、民生用電子機器（3C製品）の保証仕様が日常的な使用環境下で確実に満たされていることを保証するためには、徹底的な製品試験の実施が不可欠です。
民生用電子機器業界における新技術、新素材、そして小型化への継続的な傾向は、製品が市場に投入される前に、設計者や製品試験のシナリオに新たな課題をもたらしています。
Miniature piezoelectric 1-component load cells to perform impact testing and fast fracture testing on consumer electronics materials are distinguished by:
It is necessary to know the impact of force, acceleration and impact orientation when the product contacts the ground. The measurement of high impact forces requires sensors with high stiffness, linearity/low crosstalk errors of the sensor. We provide calibrated single and multicomponent force sensor and accelerometer solutions for precise measurement. Piezoelectric sensors offer considerable advantages over strain gauge sensors that are commonly also used for impact testing.
Unsurpassed precision, long life, wide bandwidth/ fast response time, long-term operational stability, reliability and easy handling during demanding drop testing / impact testing procedures make piezoelectric load cells from Kistler the preferred choice.
Piezoelectric dynamometers to perform drop/impact testing on consumer electronics are typically composed of piezoelectric load cells, featuring:
You can choose from:
As time duration and frequency are inversely proportional, the dynamometer force plate needs to be designed so that the natural frequency is at least 3 to 5 times higher than the expected frequency content of the drop test.
Piezoelectric accelerometer to perform drop/impact testing on consumer electronics (3C products):
World's smallest miniature triaxial IEPE accelerometer (low mass: 6 mm ( 0.236”) cube, 0.9 gram sensor mass with low mass/flexible cable (1.2 mm OD, 3.2 gram/m) can be mounted to very small test units.
Protection against damages caused by the impact forces loaded through dropping is an important concern for the design of wearable or portable consumer electronic products. The damage may include cracking of the screen, break in the device or severe functional damage.
The purpose of drop testing is to validate the design goals and workmanship based on possible operational scenarios to verify durability. It addresses the handling survivability of products and encompasses various testing scenarios including transportation (shipment via train, plane, ship, car).
Drop testing also validates analytical models which are also used during the development of consumer electronics. Analytical models allow to cost-effectively evaluate designs without testing prior to prototyping which saves costs and supports faster 3C product time to market and satisfying price point requirements.
Typically, a drop tower comprised of a platform for drop-off on top and a force dynamometer at the bottom is applied. Eventually, a triaxial accelerometer is to be mounted on the unit under test as well.
Drop a 3C consumer electronics device (laptop, smartphone, tablet) without external packaging from various heights and orientations on the dynamometer force plate to measure the impact force. Compare performance to the intended design goals and evaluate the test unit for damage.
The small size and low weight of our accelerometers allow for flexible sensor mounting including mounting them to inside packages, onto or even inside actual products under test. MEMS accelerometers allow the measurement of free fall conditions prior to impact as well as full characterization of the actual impact event.
Miniature triaxial IEPE and triaxial MEMS capacitive accelerometers to perform packaging testing on consumer electronics are optimized for low frequency measurement with dynamic measurement capabilities, featuring:
Accelerometer for drop testing of 3C products:
World's smallest miniature triaxial IEPE accelerometer (low mass: 6 mm ( 0.236”) cube, 0.9 gram sensor mass with low mass/flexible cable (1.2 mm OD, 3.2 gram/m) can be mounted to very small test units.
Packaging testing assesses how a package and its contents react to impacts during shipping and handling. The test helps manufacturers address design flaws, improve durability, minimize product damage, loss, and associated costs, avoid over-packaging, which is more expensive for businesses, avoid under-packaging, which endangers goods resulting in higher costs due to the destruction of products during transportation. The test can also help determine the survivability of a product's packaging and indicates structural and mechanical weaknesses not necessarily detected in shock and vibration tests.
HALT and HASS testing requires accelerometers featuring extreme temperature stability. Applications apply control and response accelerometers. Control accelerometers are used to monitor the input vibration to the test article and are typically single axis accelerometers. Response accelerometers measure the vibration of the test article as a result of the input vibration and are triaxial.
PiezoStar single axis and triaxial accelerometers for ESS, HASS and HALT testing, featuring:
Environmental stress screening (ESS) involves applying stresses to a product until it fails. A combination of Highly Accelerated Life Testing (HALT) and Highly Accelerated Stress Screening (HASS), as part of the ESS testing methods, improves product reliability by early detection of such failure mechanisms, helping to reduce repair or replacement costs. ESS is an effective means to address the possibility of failures of a consumer electronic device in the field.
ESS measuring chains utilize control accelerometers, response accelerometers, data acquisition systems, signal conditioning, climatic chambers, shakers and controllers. The testing process usually takes 3 to 5 days. It comprises several stages where the unit under test (UUT) is exposed to conditions such as:
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