The innovative NCFQ high-speed joining system combines the dynamics of an electromagnetic linear direct drive from LinMot with the precision of piezoelectric measurement technology. It is specifically designed for highly dynamic applications with low forces of up to 500 N – for example, in electronic components assembly and control or in relay or haptic testing.
Solderless press-fit joints are highly reliable and safe against external influences such as vibrations, impacts or shocks. Thanks to these advantages, press-fit technology (also: cold welding) is the fastening technology of choice for a number of assembly operations involved in the manufacture of products in the 3C industries – the computer, communication and consumer electronics sectors.
For example: the press-fit method is used to assemble printed circuit boards (PCBs) with power electronics and connectors for circuit boards; it is also used in board-to-board assembly of PCBs (backplanes or back panels). Performing these complex joining processes to high standards of quality and efficiency presents a challenge: how can force and positioning be controlled with precision? The same issue arises with display bonding processes to join particularly sensitive materials and components such as glass and touch sensors: here too, it is essential to apply the required press forces with maximum precision and repeat accuracy.
